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Resin Descriptions <br />Chlorendic Polyester Resins <br />Chlorendic polyester resins are based on the <br />incorporation of chlorendic anhydride or chlorendic acid <br />(also called HET acid) into the polymer backbone. Their <br />most notable advantage is superior resistance to mixed <br />acid and oxidizing environments, which makes them <br />widely used for bleaching and chromic acid or nitric <br />acid containing environments, such as in electroplating <br />applications. The cross linked structure is quite dense, <br />which results in high heat distortion and good elevated <br />temperature properties. This is a dense structure that <br />can display reduced ductility and reduced tensile <br />elongation. Despite good acid resistance, chlorendic <br />resins should not be used in alkaline environments. <br />Due to the halogen content, chlorendic resins display <br />flame retardant and smoke reduction properties. <br />The DIONO 797 series are chlorendic anhydride based <br />resins with good corrosion resistance and thermal <br />properties up to 350° F. DIONO 797 is supplied as a <br />pre -promoted and thixotropic version. An ASTM E-84 <br />flame spread rating of 30 (Class II) is obtained with the <br />use of 5% antimony trioxide. Many thermal and cor- <br />rosion resistant properties are superior to those of <br />competitive chlorendic resins. <br />Atprime® 2 Bonding & Primer <br />Atprime® 2 is a two -component, moisture -activated <br />primer that provides enhanced bonding of composite <br />materials to a variety of substrates, such as FRP, <br />concrete, steel, or thermoplastics. It is especially <br />well suited for bonding to non -air -inhibited surfaces <br />associated with contact molding or aged FRP <br />composites. This ability is achieved due to the formation <br />of a chemical bond to the FRP surface. Atprime® 2 is <br />free of methylene chloride and features good storage <br />stability. <br />Atprime® 2 is well-suited for repairs of FRP structures. <br />Many FRP structures have been known to fail due to <br />the failure of secondary bonds, which can serve as <br />the weakest link in an otherwise sound structure. <br />Thus Atprime® 2 merits important consideration in <br />FRP fabrication. The curing mechanism relies on <br />ambient humidity and does not employ peroxide <br />chemistry. <br />Castings <br />Resin <br />Tensile <br />Tensile s <br />Modulus x10 <br />Elongation at <br />Flexural <br />Flexural s <br />Modulus x10 <br />Barcol <br />HDT° F <br />Strength psi <br />Break % <br />Strength psi <br />Hardness <br />psi <br />psi <br />DIONO 9100 <br />11600 <br />4.6 <br />5.2 <br />23000 <br />5.0 <br />35 <br />220 <br />DIONO FR 9300 <br />10900 <br />5.1 <br />4.0 <br />21900 <br />5.2 <br />40 <br />230 <br />DION® 9800 <br />13100 <br />4.6 <br />4.2 <br />22600 <br />4.9 <br />38 <br />244 <br />DION@ 9400 <br />9000 <br />5.0 <br />3.0 <br />20500 <br />5.1 <br />38 <br />290 <br />DIONS 6694 <br />8200 <br />3.4 <br />2.4 <br />14600 <br />4.9 <br />38 <br />270 <br />DIONO 6631 <br />9300 <br />5.9 <br />2.4 <br />16600 <br />5.2 <br />40 <br />225 <br />DION® 382 <br />10000 <br />4.3 <br />2.5 <br />17000 <br />4.3 <br />38 <br />270 <br />DIONO 797 <br />7800 <br />0.5 <br />1.6 <br />21700 <br />1.0 <br />45 <br />280 <br />DIONO 490 <br />8700 <br />4.8 <br />2.1 <br />16700 <br />5.2 <br />40 <br />260 <br />