Laserfiche WebLink
Table I <br /> The following chemicals do not attach or permeate high density crosslinkable polyethylene resins up to 100° F. <br /> Each application should be considered individually. All concentrations apply except where noted. <br /> Acetic Acid Ethyl Alcohol Mercury Stannous Salts <br /> Aluminum Salts Ethylene Glycol Methyl Alcohol Starch Solutions <br /> Alum Ferric Salts Methylsulfuric Acid Stearic Acid <br /> Ammonium Hydroxide Ferrous Salts Michel Salts 'Sulfuric Acid <80% <br /> Ammonium Salts Fluoboric Acid Nicotinic Acid Sulfurous Acid <br /> Amyl Alcohol Fluosilicic Acid Nitric Acid<50% Sugar Solution <br /> Antimony Salts Formic Acid Oxalic Acid Glucose <br /> Arsenic Acid Gallic Acid Perchloric Acid Lactose <br /> Barium Hydroxide Gluconic Acid Phenol<10% Sucrose, etc. <br /> Benzene Sulfonic Acid Hexanol Potassium Hydroxide Tannic Acid <br /> Bismuth Salts Hydrazone<35% Potassium Salts Tanning Extracts <br /> Boric Acid Hydrozine Hydrochloride Phosphoric Acid Tartaric Acid <br /> Bromic Acid Hydriodic Acid Photographic Solutions Titinium Acid <br /> Butanediol Hydrobromic Acid Propyl Alcohol Toluene Sulfonic Acid <br /> Butyl Alcohol Hydrochloric Acid Propylene Glycol Triethanolamine <br /> Calcium Hydroxide Hydrofluoric Acid Sea Water Urea <br /> Calcium Salts Hydrofluorosilicic Acid Selenic Acid Vinegar <br /> Chromic Acid<50% Hydrogen Peroxide<52% Sewage Wetting Agents <br /> Citric Acid Hydrogen Phosphide Silicic Acid Salts: ,y <br /> Copper Salts Hydroquinone Silver Salts <br /> Detergents Hypochorous Acid Soap Solutions <br /> Diazo Salts Iodine Solutions Sodium Ferricyanide DEC 0 S 2016 <br /> Diethyl Carbonate Lactic Acid Sodium Ferrocyanide <br /> Diethanol Amine Latex Sodium Hydroxide <br /> Diethylene Glycol Lead Acetate 'Sodium Hypochlorite<g% ENVIRONMENTAL HEALTH <br /> Diglycolic Acid Magnesium Salts Sodium Salts 'concentratbfis'atsoVestateaper- <br /> Dimethylamine Mercuric Salts Sodium Sulfonates cartage require special considera- <br /> tions,Formamide Mercurous Salts Stanic Salts tions,contact these apory for guidelines <br /> Dimethyl concerning these applications. <br /> Table II <br /> The following oils and organic chemicals do not Fatty Mineral Animal Vegetable <br /> attack HDXLPE resins. They will be absorbed into Acids Oils Fats Oil <br /> the wall of the tank; however, there should be no Butyric Lube Lard Corn <br /> loss of chemical. Because of this absorption, no Laurie Transformer Fish Oil Coconut <br /> chemical other than the original should be stored in Linoleic Hydraulic Musk Oil Cottonseed <br /> the tank as long as contamination may result as the Oleic Whale Oil Olive <br /> absorbed oil is leached out. Storage at Palmitic Peanut <br /> temperatures up to 100° F are possible provided the Stearic <br /> effects of the absorption on the properties of the <br /> tank are not prohibitive. <br /> Table III Anitine Ethyl Butyrate Nitrobenzene <br /> The following organic chemicals do not attack high Benzene Ethylene Chlorohydin Octyl Cresol <br /> density`crosslinkable polyethylene resins. They will Carbon Tetrachloride Fuel Oil Propylene Dichloride <br /> Chlorabenzene Fufural Toluene <br /> be absorbed into the wall of tank and a permeation Cychohexanol Aliphatic Hydrocarbons Xylene <br /> loss will occur. Because of this permeation and the Cycolohexnone (hexane, octane, <br /> effect it has on the physical properties of the tank, it Dibutylphthalate hexene, octene, etc.) <br /> is generally not recommended that these chemicals Diesel Fuel Jet Fuel <br /> be storage at room temperatures above 100° F. Dimethylamine Gasoline <br /> However, their use largely depends on such factors <br /> as size of tank, its location, toxicity of the chemical, anis ecodocumentndations accurate guaranteed <br /> reliablei because <br /> the bests of use are beyond our co tro. ons <br /> and recommendations cannot be gueranteetl because the contlidons of use are beyond our contra. <br /> andapplicable codes such as NFPA, OSHA, etc. Information presented herein is given without reference to any patent questions which may be encountered <br /> pp n use thereof.Such questions should be investigated by those using this information.Poly Processing <br /> Company assumes no responsidlity for the use of information Presented herein and hereby disclaims all <br /> Iiadlity in regard b such use. <br />