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WET PROCESS <br /> wT <br /> T <br /> I , <br /> e , <br /> This is the plating/wet monia billuonde to remove The copper plating line <br /> process area. Large,clean glass,resulting in a 3 part includes two 1000 gallon <br /> and well ventilated. The elec- connection to inner layer tanks designed especially for <br /> troless and smear removal copper. large Backpanel boards and <br /> lines are semi-automated to All inner layers are boards with high aspect plat- <br /> ensure consistent hole clean- treated with Brown Oxide to ing ratios such as"surface <br /> ing and copper deposition. ensure excellent adhesion mount"types. <br /> Chromic is used to re- characteristics in the lamina- <br /> move epoxy smear and am- tion process. <br /> A Technic Aut$$$Latic Tip <br /> Plater with duplex cells <br /> and automatic unloa er allows <br /> us to be very competitive <br /> tiw on boards that require <br /> _y _ ontacts. <br /> z <br /> , i <br />