Laserfiche WebLink
i <br /> DrillingLog <br /> FiWiroriamta! RQSQU s MaTngmant <br /> Sketch Map � <br /> { Protect I Y LU��'A ��a:. Owner <br /> i <br /> Location }G C.Kia —W.O. Number 1 <br /> � &cr�� - 5+ <br /> Y Number Total Depth Diameter <br /> Surface Elevation Wafer Level. Initial <br /> q2 - 24-hrs. <br /> Screen: Dia. Length Slat Size <br /> T e <br /> Casing. bia. Length_ YP Notes <br /> Drilling Company S F r Drilling Method H S A <br /> Driller �rccce ^t-Brvc� Log BY J Date Drilled {t is O i <br /> J Description/Soil Classification <br /> L r � a (Color, Texture. Structures) <br /> n - E E <br /> O C7 U v7Z t� Zs S#ter{ [ME S <br /> i <br /> i <br /> J <br /> z / <br /> Dar E: bra ran gy M o c S�l S �� CIA `+-"rot i <br /> 3 <br /> t 1 <br /> a <br /> t <br /> f <br /> 9 I <br /> j E� Ke a �.nrd�an \�e� Iler ��� <br /> s <br /> i <br /> - 12- <br /> 13 <br /> Z+3 <br /> Page 1 0f� .L <br />