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CONDOR E TEC OG ES • <br /> 188 f=rank West Circle,Sulto i,Stockton CA 86206 GROUNDWATER MONITORING FIELD FORM <br /> SITE: i1 S ��}C.r' +�C - WI~LL ID: ` <br /> PROJECT NO: �07 CONDOR PE SONNEL: . i._- �•�1�.� <br /> AMBIENT CONDITIONS (Clrcle)� air adverse (describe in notes section) DATE: 7 T <br /> 2 PRE-PURGE DATA: Purge Volume Protocol (#of casing volumes) ] _ <br /> Well Cas. oe tt (f_} � (Circle: easur <br /> - Depth-to-Water. 33y2 (sut1 detail) WeII Casing Diameter(n.) <br /> bract <br /> �r <br /> from well casing Depth) Measuring Point Locationo <br /> =Water Columb 4-47 Purge Vol. Calc. (for 1 casing vol,) Z.Z•S - `T S _� <br /> (multipliers: 2 inch=.163,4 inch-.653, 5 inch=1.02) <br /> Field Inspection Sam Appearance: JeAr 0400 Aar S�/"i�A <br /> Odor: <br /> nn{Specify color, agree of Clarity,presence of sheen or product phase] (Specify s ght,moderate,Cr strong) <br /> 3 PURGE DATA: Purge Device: lk ,-- <br /> If pumped, specify: discharge rate (gpm) depth pump set at (ft.) <br /> Ittn© Y-Ow -e-aff a T- mveratutl= ah EC <br /> -M/PM (start) If well purges dry, specify the following: <br /> A <br /> ) {cumulati>,a) (circle: F/0 <br /> .�__AM1P_M 1) time <br /> 3-$ . � � 745 dS 2)volume purged <br /> PO AM 1 PM Z 7.04 8 3 v S 3)depth to water <br /> o A KA µa z�•7 IS ,$ �,� q) depth to water for 80% recovery <br /> R ?'a r,I_ <br /> fg M I MP-M `�-� 'r. z�" �-— 7.4 6 � VS' 5) depth to water at time of sampling <br /> 2.7 -7.61* S! .v S <br /> Total Vol, Purged (gals,) �7• S <br /> 4 SAMPLING DATA: Jyp Qf Contac Requested Analysis <br /> 3 llo Of TAC- _ Time Collected 15 3c <br /> T+fr Collection Device ecpm .*S-CAq fe <br /> Teff-C� Sample ID 1707 - .,Af C✓ p <br /> 6 Q"I Q SAMPLES; Duplicate(circle);Yes IQ Sample ID <br /> Rinsate on sample collection device used on this well (circle): Yes 4o Sample ID <br /> 6 CO : Sta <br /> IAMINAIIQN-Method(circle) ndard Proce re I Other <br /> (Standard decontamination procedure consists of wastihig gear will,a solution of organic pure water and 1?quhoa and then double rinsing with organic pure wafer.If another method Is used,describe In the field holes section.} <br /> 7 ADDITIONAL.FIELD NOTES: <br /> 0:1FormMI'leld Form slgwrnfflgwmff.xls <br />