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GROUNDING & BONDING FOR <br />ELECTRICAL SYSTEMS <br />Section 16450 <br />15-1207 <br />PART GENERAL <br />1.1 SUMMARY <br />A. Section Includes: <br />1. Rod electrodes. <br />2. Active electrodes. <br />3. Wire. <br />4. Grounding well components. <br />5. Mechanical connectors. <br />6. Exothermic connections. <br />1.2 REFERENCES <br />1.3 Institute of Electrical and Electronics Engineers: <br />1. IEEE 142 - Recommended Practice for Grounding of Industrial and <br />Commercial Power Systems. <br />2. IEEE 1100 - Recommended Practice for Powering and Grounding <br />Electronic Equipment. <br />B. International Electrical Testing Association: <br />1. ANSUNETA ATS - Acceptance Testing Specifications for Electrical Power <br />Equipment and Systems. <br />C. Part 3, Title 24, - California Electrical Code (CEC). <br />1.4 SYSTEM DESCRIPTION <br />A. Grounding systems use the following elements as grounding electrodes: <br />1. Existing Metal underground water pipe. <br />2. Metal building frame. <br />3. Concrete -encased electrode. <br />4. Existing Metal underground gas piping system. <br />5. Rod electrode. <br />6. Plate electrode. <br />1.5 DESIGN REQUIREMENTS <br />A. Construct and test grounding systems for access flooring systems on conductive <br />floors accordance with IEEE 1100. <br />1.6 PERFORMANCE REQUIREMENTS <br />A. Grounding System Resistance: 5 ohms maximum. <br />1.7 SUBMITTALS <br />