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SS200 Series Properties 0 75°F (24°C) Product Working Time Minutes Fixture Time Minutes SS208/SS214B 8_12 >25 SS214/SS214B 17-22 SS218ISS2188 30-45 >>3535 SAFETY AND HANDUNG 80 faced Afa*dW Saltrty Data Shs*before handing or uawg this pmduct The A component adhesive contains methyl methacrylate monomer and is flammable. Aiways use in a weN"n9sted area. Floor-levet extraction and latae quantities of moving air greatly iactiilate ventilation. Activator (Compntaxorert B)contains peroxide. Both materials must be stored in a Cool place away from sources of heat and open flames or sparks. Keep Goera CJDaed when not in use. Prevent contact with skin and spa. In came of"contact,wish with soap and water. In case of eye contact.flush with wafer for 15 min tm and seek knmedWW medical attention. Harmful lfswallowed. Keep out of reach of children. MIXING AND APPLICATION EXOTHERM: The chemical curng reaction that occurs when components A and B are mixed generates heat The amount of heat generated is corltraNed by the mass and t)dckneas of the mixed product. Large masses over 112 inch ihidc can develop heat in excess of 25WF/121-C and can generate ,flammable vapors. Large curing masses should be cars"moved to a well-ventilated area where the chance of personal contact is CURING:The term Open working tlme is the approximate time alter mWW components A and 8,depending on the bonding conditions that the 009"remains tinct and bondable. Fixture time is the approximate Ilene after mixing components A and 8 required for the adhesive to develop atrlNdart sbangtn to stow csreftd movement,urtdamping or da-motding of assembled parts. Parts can gernerally be put len asrvice when 80 paroerkt of in full abengtlh id developed. The time to achieve 849E Cure le approximately 2 3 times that required for Nxdcainp.The working and fixture times presented s��traced an laboratory tdats perfonnad et 7b'F/24'C. Fighar temper�dunes speed the curirp reaction,which mdutxs open worlring time V w temper �dp yre � far lower temperaWres tf aignitic ant vacation in tamperature�s or aPPaticn at very him reP�enatve tar tednnlca!esefsance. DISPENSING EQUIPMENT: Dispensing directly from disposable cartridges or meter-mix.diaper>dkp aquipmant is atroxgly recommended_ Both meteDds ampioy vornvarriert stack motionless mixer technology Product supplied in gra-measured cartridges Is dispensed from approved manual or Poetic powered guns. Contact your IPS representative for kxformallm and availability. 4410 melt-mbc dispense systems are used,care must be taken to assure compaWa ty between the adhesive components and the materials in the equipment that they conal. AN wetted metal components should be constructed of stakrteas steel or aluminum or have a sufficient thickness of cFeeAeally msktaM material that prevents contact between the adhesive components and the base metal. Contact with copper,zlnq brass or other Moya aaet N*V thane mete Wa must be gdctly prevented AN non-n"llic seals and gaskets should be fabricated tram Taft*or UHMW polyet VWW based materials. Nahrel rubber,niditb rubber(9tfl",neoprene acrd VNWO we not acceptable.E}hytane-propylene rubbom such as lords)®may be used for ram ddlawer plate o-its,but a pdyethylena sheet must be used to prevent dract contact with the atlhesNe. APPLICATION: Fallow instruction provided or contact your IPS representative for proper preparation of dispensing equipment and substrates prior to sating the bonding process. Always dispense a quantity of adhesive at startup to assure that the adhesive e*UM the ftp of the mixer is the proper CObf and is udfCnn.without streaks. If previa sly operhed or aged material is being used,allow the Purged material t0 care to assure quality before proceedkhg. Carefully dispense a avt[khant quant[ty of adhesive On tike subatrale te aaaurs that the bond gap will be completely filed when the parts are mated. Allow for squeeze-out at the edges of the bond to assure filling. Carefully secure or damp parts to prevent joint movement while the adhesive 9999499 csegeanastpssieetlsavaedpnhrdaoerdssetuiaarvctserv.sfe.rPotTmaherte atiabht llaethy nbedcoutInaledreunreedfr.d ngaKadash!dnsehedsemiovsubeivblyewtre..aunMst a6tehse eakrhieenddmmggosaevosperedfoss wrpoaflirtcnh oegtarehs mesthroaaptisrropehtteaktrnhcditlenfevegesaa snp d. CLEAN UP: Adhesive components and mixed adhesive should be removed from mixing and application equipment with a suitable Industrial solvent or dexter before the mired adhesive cures. Once the adhesive axes,soaking in I strong solvent or paint remover will be required to soften the adhesive for removal.If the bonds are exposed to UV rays then use of plasticizers such as Dibutyl-Phalate(DBP)is recommended,or contact your IPS mpresentad"for additional Information.Any dean-up of the bonded assembly using industrial solvents Is not recommended as it could affect the cure. STORAGE AND SHELF LIFE The shelf He of Components A and B In u rp"ned containers is approximately six months from fire dais the product Is shipped from IPS facNtiies. Shelf ifs is based On steady state storage between 54-F and 84-F(10-C and 2rC). Exposure.intamkgtent or prolonged,above 80-F/27•C WIN result in a reduction of the stated shelf Life.Exkposwas above 1001F(3M)during shfpphrg Or storage can qucA*degradie Comparrent 8 in Carftoss or bulk CDntainers;and must be shtc Wprevented. Shelf lire of both components can be extended by air-conditioned or refrigerated storage between 50'F and WF(10-C and 18-C).KEEP FROM FREEZING. IMPORTANT MOTES a. SUBSTRATE AND APPLICATION COMPATIBILITY. The user must determine the suitability of a selected adhesive for a given substrate and appNcatio,m IPS strangiy recommends laboratory.slop and end-use testing that simulates the actual manufacturing and end-use environment b. SURFACE PREPARATION: The need for surface preparation must be determined by comparative tsatkg of prepared and unprepared substrates to assure that unprepared bonding is equivalent to or acceptable for the appka&m relative to prepared banding- Initial bonding tests must be followed up with simulated or actual durability tests to assure that surface cxditlon do not lead to degradation of the bond over time under service 0=11tions. Subsequent denges in substrates or boding axxndition will require miss ft. Q TECHNICAL ASSISTANCE: Canted your IPS representative for questions of assistance with the selection of adhesives and methods for evaluating adhesives for your intended application. This product Is intended for use by skilled individuals at their own risk. Recommendation contained twain aro based on information we believe to be reliable. The properties and Warp values presented above are typical properties obteked under controlled condition at the IPS laboratory. They are k*K*od to be used only as a guide for selection for end-use evaluation. The ultimate suitability for any intended apptiosew must be verfled by tlne end UW under anticipated test conditions. Since specific use,materials and product handling are not controlled by iPS,our warranty is limited to we neplacernent of detective iPS products. IPS Corp.PO Box 12729.Research Triangle Park.NC 27749• www.icscoro.cam•Tot Free:1-877-IPS GLUE•FAX(919)588-2439 SS24li 9/08