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08 September 2000
<br />AGE -NC Project No. 97-0372
<br />Page 5 of 18
<br />The northern portion of the existing building was utilized by RV Circuits for photography and film,
<br />office and business space, the southern half was utilized for plant maintenance, processes related to
<br />the manufacturing of circuit boards, and chemical and equipment storage. The covered,
<br />concrete -floored area south of the building was utilized for the waste water treatment facility and for
<br />chemical storage. The asphalt -paved area east of the southern half of the building was utilized for
<br />above -ground tank storage of treated water and manufacturing chemicals.
<br />Review of RV Circuits' Material Data Safety Sheets found in binders in the building identified the
<br />following processes conducted and materials utilized for the processes during the manufacture of the
<br />circuit boards:
<br />• General - high and low pH corrosives, slacked lime (calcium hydroxide), metal hydroxide
<br />sludge (containing copper, nickel and lead), and Clarofloc GW 2 1 X (acrylamide -acrylic acid
<br />copolymer emulsion in paraffin oil);
<br />• Q Posit Process - Macudizer 9204, 9275, 9276 and 9279 (polar aprotic organic solvents),
<br />etching agents, Electroless Copper 22A and 2213, Accelerator 41-C, Catalyst Premix and
<br />TS -16;
<br />• Silk Screen & DryFilm -Hydrogen peroxide, Foam Free (R) 946 rev (organics, glycol ether),
<br />cellosolve acetate, potassium carbonate (K2CO3), Laminar (R) AE dry film photopolymer
<br />(acrylic monomers), 24D Liquid developer, Screen Cleaner 420;
<br />• Black Oxide Process - Sulfuric acid, 748 Salts (potassium peroxymonosulfate);
<br />• Solder Plating Process - Acid cleaner 717, sulfuric acid, copper sulfate, hydrochloric acid,
<br />Fluoborate Grain Refiner (purified petone solution), hydrogen peroxide, fluoboric acid, tin
<br />fluoborate solution, lead fluoborate solution, boric acid, nitric acid, and Talco Metals (99.9%
<br />copper);
<br />• Etching & Solder - Etchant (alkaline), ammonium hydroxide, Solder Flow 10 and 5
<br />(oxyalkalated glycerin, oxyalkalate in a glycol ether), copper chloride, and hydrochloric acid;
<br />• Tan Plating Process - Nickel sulfanate, nickel chloride, sulfuric acid, M&T Nickel Additive
<br />SA -1 (aliphaticsulfanate; formaldehyde), M&T RR5 (organic), M&T AP20 (anionic
<br />surfactant, formaldehyde), M&T Anti -pit No. 12 (anionic surfactant, formaldehyde), M&T
<br />Nickel Additive PCB (formaldehyde, benzoic sulfimide), Solder Stripper 709 (ammonium
<br />bifluoride, hydrogen peroxide), M&T SNP Solder Stripper (acids), M&T CK Copper
<br />Conditioner (surfactants, ferric chloride), and Orosene 80 Gold Salts (potassium cyanorate,
<br />cobalt complex).
<br />Only the locations of the silk screen, dry film, solder, and nickel and gold processes are documented
<br />at this time as shown on site plans acquired by AGE. Most, if not all, of the processes described
<br />Advanced GwEnvironmental, Inc
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