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SS200 Series Properties @ 75°F (24°C) Product Working Time Minutes Fixture Time Minutes SS208/SS214B 8-12 >25 SS214/SS214B 17-22 >35 SS218/SS218B 30-45 >80 SAFETY AND HANDLING Read Material Safety Data Sheet before handling or using this product The A component adhesive contains methyl methacrylate monomer and is flammable. Always use in a well-ventilated area. Floor-level extraction and large quantities of moving air greatly facilitate ventilation. Activator (Component B)contains peroxide. Both materials must be stored in a cool place away from sources of heat and open flames or sparks. Keep containers closed when not in use. Prevent contact with skin and eyes. In case of skin contact,wash with soap and water. In case of eye contact,flush with water for 15 minutes and seek immediate medical attention. Harmful if swallowed. Keep out of reach of children. MIXING AND APPLICATION EXOTHERM: The chemical curing reaction that occurs when components A and B are mixed generates heat. The amount of heat generated is controlled by the mass and thickness of the mixed product. Large masses over 1/2 inch thick can develop heat in excess of 250°F/121`C and can generate harmful,flammable vapors. Large curing masses should be carefully moved to a well-ventilated area where the chance of personal contact is minimized. CURING:The term Open working time is the approximate time after mixing components A and B,depending on the bonding conditions that the adhesive remains fluid and bondable. Fixture time is the approximate time after mixing components A and B required for the adhesive to develop sufficient strength to allow careful movement,unclamping or de-molding of assembled parts. Parts can generally be put in service when 80 percent of full strength is developed. The time to achieve 80%cure is approximately 2-3 times that required for fixturing.The working and fixture times presented in this bulletin are based on laboratory tests performed at 75°F/24°C. Higher temperatures speed the curing reaction,which reduces open working time and speeds the development of strength. The reverse is true for lower temperatures. If significant variation in temperatures or application at very high or low temperatures is anticipated,contact your IPS representative for technical assistance. DISPENSING EQUIPMENT: Dispensing directly from disposable cartridges or meter-mix-dispensing equipment is strongly recommended. Both methods employ convenient static motionless mixer technology. Product supplied in pre-measured cartridges is dispensed from approved manual or pneumatic powered guns. Contact your IPS representative for information and availability. When meter-mix dispense systems are used,care must be taken to assure compatibility between the adhesive components and the materials in the equipment that they contact. All wetted metal components should be constructed of stainless steel or aluminum or have a sufficient thickness of chemically resistant material that prevents contact between the adhesive components and the base metal. Contact with copper,zinc,brass or other alloys containing these matehals must be strictly prevented. All non-metallic seals and gaskets should be fabricated from Teflon®or UHMW polyethylene based materials. Natural rubber,nitrile rubber(BONA),neoprene and Vfton®are not acceptable.Ethylene-propylene rubbers,such as Nordel®may be used for ram follower plate o-rings,but a polyethylene sheet most be used to prevent direct contact with the adhesive. APPLICATION: Follow instructions provided or contact your IPS representative for proper preparation of dispensing equipment and substrates prior to starting the bonding process. Always dispense a quantity of adhesive at start-up to assure that the adhesive exiting the tip of the mixer is the proper color and is uniform,without streaks. If previously opened or aged material is being used,allow the purged material to cure to assure quality before proceeding. Carefully dispense a sufficient quantity of adhesive on the substrate to assure that the bond gap will be completely filled when the parts are mated. Allow for squeeze-out at the edges of the bond to assure filling. Carefully secure or clamp parts to prevent joint movement while the adhesive sets. Do not apply excessive pressure that can cause excessively thin gaps and starve the bond line. If in doubt,use shims or spacers to set the gap. A minimum gap of 20 mils(0.020 inch)is recommended for the SS200 series products. Test the curing adhesive at the edges for fingernail hardness before removing clamps or fixtures. Use a soft faring tool to remove excess adhesive from the bonded assembly.Masking tapes or other protective barriers should be used to prevent contamination on any cosmetically sensitive areas. Partially cured adhesive can be removed with a sharp knife and any cured adhesive may be removed by sanding or scraping. CLEAN UP: Adhesive components and mixed adhesive should be removed from mixing and application equipment with a suitable industrial solvent or cleaner before the mixed adhesive cures. Once the adhesive cures,soaking in a strong solvent or paint remover will be required to soften the adhesive for removal.If the bonds are exposed to UV rays then use of plasticizers such as Dibutyl-Phalate(DBP)is recommended,or contact your IPS representative for additional information.Any clean-up of the bonded assembly using industrial solvents is not recommended as it could affect the cure. STORAGE AND SHELF LIFE The shelf life of Components A and B in unopened containers is approximately six months from the date the product is shipped from IPS facilities. Shelf life is based on steady state storage between 50`F and 80°F(100C and 27°C). Exposure,intermittent or prolonged,above 80°F/27°C will result in a reduction of the stated shelf life.Exposures above 100°F(38°C)during shipping or storage can quickly degrade Component B in cartridges or bulk containers,and must be strictly prevented. Shelf life of both components can be extended by air-conditioned or refrigerated storage between 50°F and 65°F(10°C and 18°C).KEEP FROM FREEZING. IMPORTANT NOTES a. SUBSTRATE AND APPLICATION COMPATIBILITY. The user must determine the suitability of a selected adhesive for a given substrate and application. IPS strongly recommends laboratory,shop and end-use testing that simulates the actual manufacturing and end-use environment. b. SURFACE PREPARATION: The need for surface preparation must be determined by comparative testing of prepared and unprepared substrates to assure that unprepared bonding is equivalent to or acceptable for the application relative to prepared bonding. Initial bonding tests must be followed up with simulated or actual durability tests to assure that surface conditions do not lead to degradation of the bond over time under service conditions. Subsequent changes in substrates or bonding conditions will require re-testing. c. TECHNICAL ASSISTANCE: Contact your IPS representative for questions or assistance with the selection of adhesives and methods for evaluating adhesives for your intended application. This product is intended for use by skilled individuals at their own risk. Recommendations contained herein are based on information we believe to be reliable. The properties and strength values presented above are typical properties obtained under controlled conditions at the IPS laboratory. They are intended to be used only as a guide for selection for end-use evaluation. The ultimate suitability for any intended application must be verified by the end user under anticipated test conditions. Since specific use,materials and product handling are not controlled by IPS,our warranty is limited to the replacement of defective IPS products. IPS Corp.PO Box 12729,Research Triangle Park,NC 27709• www.il)scorl).com•Toll Free:1-877-IPS GLUE•FAX(919)598-2439 SS200 9/05