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Environmental Standard Procedure <br /> Page 2 <br /> ® 12% (wt) Ammonium Bifluoride Frost Solution (pH < 2) — Etch Room East Wall Floor <br /> Drain <br /> • Alumi Etch (< 1% vol) Rinse (pH > 12) — Etch Room East Wall Floor Drain <br /> s Alumi Etch (15% vol) Solution (pH > 12) — Etch Room East Wall Floor Drain <br /> • 20% (vol) Chemco 33S Solution — Etch Room East Wall Floor Drain <br /> CPS A7 Screen Wash —Wash Basin in Screen Prep <br /> . 1% (wt) Specialty Cleaner 740 Solution — Etch Room West Wall Floor Drain <br /> 3.2. Disposal Procedures <br /> 3.2.1. Zip Developer — the spent plate developing solution is discharged into the U1 T2 <br /> process waste water collection tank via the Metalphoto processor Waste <br /> Developer' collection container. When the processor is serviced and cleaned, the <br /> waste developer container is emptied into the sink drain located along the west wall <br /> of the darkroom. The amount of discharge is 3 gal per processor service and the <br /> frequency is related to the quantity of Metalphoto sheets processed, therefore, the <br /> person responsible for servicing the processor must record the discharge <br /> information on the Darkroom Hazardous Waste Log. <br /> 3.2.2. Zip Fixer - the spent plate fixing solution is discharged into the U1 T2 process <br /> waste water collection tank via the Metalphoto processor°Waste Fixer" collection <br /> container after silver recovery has been completed. The collected waste fixer is <br /> poured into the Silver Recovery system tank. The Silver Recovery system is <br /> activated and monitored by the person servicing the Metalphoto processor. Test <br /> strips are used to indicate silver concentration. That person makes entries into the <br /> Silver Recovery Log and will initiate additional cycles if any silver is still present or <br /> discharge the waste fix solution into the sink located on the west wall of the <br /> Darkroom if all silver has been removed. The amount of discharge is 3 gal per <br /> processor service and the frequency is related to the quantity of Metalphoto sheets <br /> processed, therefore, the person responsible for servicing the processor must <br /> record the discharge information on the Darkroom Hazardous Waste Log. <br /> 3.2.3. Acid Purification Unit (APU) — spent anodizing solution is automatically discharged <br /> into the U1 T3 pH adjust tank via the APU located in the outside tank pad area. The <br /> APU is utilized only as needed to maintain a dissolved Aluminum concentration of <br /> 12 ppm within the anodizing tank. if the anodizing operator determines that the APU <br /> needs to be turned on in order to maintain that concentration, they will record how <br /> many cycles the APU processed that day. Each cycle discharges — 4 gallons of <br /> waste anodizing solution. Multiply the number of cycles that day by 4 to estimate <br /> the total amount discharged and record that estimate on the Anodizing Hazardous <br /> Waste Log. <br /> 3.2.4. Frost Solution — spent frost solution (ammonium bifluoride) is manually discharged <br /> into the U1 T1 process waste water collection tank via a floor drain located near the <br /> south east corner of the Etch room. When it has been determined that the Frost <br /> solution is exhausted a drain valve is partially opened draining the solution slowly <br /> into the On-Site treatment system for eventual pH adjustment. The tank is then <br /> washed and drained again with approximately 5 gallons of additional water. This <br /> results in a total discharge of -- 75 gallons each time the tank is changed. The <br /> operator responsible for discharging the frost solution must take care to routinely <br /> monitor the T5 pH controller outside to verify that the final pH discharge is between <br /> 6 to11 and then record the discharge on the Etch Hazardous Waste Log. <br />