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Table 1 <br /> Remedial Actions Used at Landfill Sites <br /> General Response <br /> Action Remedial Technologies Process Options -Description Evaluation Comments <br /> No Action None None No action. Would not meet regulatory <br /> com liance requirements. <br /> Access Restriction Deed Restrictions All deeds for property within Would not meet regulatory <br /> potentially contaminated areas would compliance requirements. <br /> includc restrictions on use of <br /> property. <br /> Fencing Security fences installed around Would not meet regulatory <br /> potentially contaminated areas to compliance requirements. <br /> limit access. <br /> Containment Cap Double Barrier Compacted clay covered with a Potentially viable. Provides <br /> (Composite Cap) synthetic membrane(20 millimeter maximum protection from exposure <br /> minimum) followed by 1 foot of sand due to direct contact. Also,this is <br /> and 1.5 feet of fill and 6 inches of the most effective capping option <br /> topsoil to provide erosion and for reducing infiltration. However, <br /> moisture control and freeze-thaw would force landfill gas(LFG) <br /> protection. generated within the waste to <br /> migrate laterally toward the property <br /> boundary. Also, would not meet <br /> re ulator compliance requirements. <br /> Removal of source Excavation Mechanical Excavation Use of mechanical excavation Potentially viable. Would release <br /> Of methane equipment to remove and load and methane to the atmosphere,quicker <br /> generation(organic transport landfill wastes for disposal than it is otherwise vented. <br /> wastes) at a permitted disposal site. Although the methane gas released <br /> would quickly mix with the ambient <br /> air rendering it safe, well below the <br /> LEL. <br /> Collection Passive Gas Removal Passive gas venting Atmospheric vents are used for Potentially viable. <br /> wells venting LFG at points where it is <br /> collecting and building up soil gas <br /> ressure. <br /> K:\Wprocess\25532\WorldEnterprise\Remediation Plan\Table l.doc 1 <br />