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30 May 2000
<br /> AGE-NC Project No. 97-0372
<br /> Page 5 of 17
<br /> • General - high and low pH corrosives, slacked lime (calcium hydroxide), metal hydroxide
<br /> sludge(containing copper,nickel and lead), and Clarofloc GW 21X (acrylamide-acrylic acid
<br /> copolymer emulsion in paraffin oil);
<br /> • Q Posit Process - Macudizer 9204, 9275, 9276 and 9279 (polar aprotic organic solvents),
<br /> etching agents, Electroless Copper 22A and 2213, Accelerator 41-C, Catalyst Premix and
<br /> TS-16;
<br /> • Silk Screen&Dry Film-Hydrogen peroxide,Foam Free(R) 946 rev(organics,glycol ether),
<br /> cellosolve acetate, potassium carbonate (K2CO3), Laminar (R) AE dry film photopolymer
<br /> (acrylic monomers), 24D Liquid developer, Screen Cleaner 420;
<br /> • Black Oxide Process - Sulfuric acid, 748 Salts (potassium peroxymonosulfate);
<br /> • Solder Plating Process - Acid cleaner 717, sulfuric acid, copper sulfate, hydrochloric acid,
<br /> Fluoborate Grain Refiner (purified petone solution), hydrogen peroxide, fluoboric acid, tin
<br /> fluoborate solution, lead fluoborate solution,boric acid,nitric acid, and Talco Metals(99.9%
<br /> copper);
<br /> • Etching & Solder - Etchant (alkaline), ammonium hydroxide, Solder Flow 10 and 5
<br /> (oxyalkalated glycerin, oxyalkalate in a glycol ether),copper chloride, and hydrochloric acid;
<br /> • Tan Plating Process-Nickel sulfanate, nickel chloride, sulfuric acid, M&T Nickel Additive
<br /> SA-1 (aliphaticsulfanate; formaldehyde), M&T RR5 (organic), M&T AP20 (anionic
<br /> surfactant, formaldehyde), M&T Anti-pit No. 12 (anionic surfactant, formaldehyde), M&T
<br /> Nickel Additive PCB (formaldehyde, benzoic sulfimide), Solder Stripper 709 (ammonium
<br /> bifluoride, hydrogen peroxide), M&T SNP Solder Stripper (acids), M&T CK Copper
<br /> Conditioner(surfactants, ferric chloride), and Orosene 80 Gold Salts (potassium cyanorate,
<br /> cobalt complex).
<br /> Only the locations of the silk screen, dry film, solder, and nickel and gold processes are documented
<br /> at this time as shown on site plans acquired by AGE. Most, if not all, of the processes described
<br /> above are assumed to have taken place in the plating bath areas in the southern portion of the
<br /> building. The locations are shown on the site map, Figure 2.
<br /> Undoubtedly, many of the materials listed above were used only in small quantities. The chemicals
<br /> of potential concern include the metals copper, nickel, lead, tin, and possibly cobalt. High and low
<br /> pH may be a local concern. During the course of several site inspections, Mr. Doug Wilson of the
<br /> PHS-EHD did not see storage or use of organic solvents on the premises; therefore the PHS-EHD
<br /> and DTSC do not consider organic solvents to be chemicals of concern.
<br /> Advanced GcoEnv'iconmental,Inc
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