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2. CWC 135: Unspecified aqugous solution <br />Site 2010 Quantity (lb) 2014quantity lb) <br />LLNL 43863 23 <br />2.1 Optic etchilira <br />This waste stream is generated periodically based on the volume of new optics required. <br />The process has been optimized to generate the minimal amount of waste while <br />producing the high quality optics required. <br />In 2009, NIF started implementation of an optics repair process to extend the Life of the <br />optics. This operation continued to expand in 2010 and reduces both the need to acquire <br />new replacement optics and the chemicals used to process them. <br />NIF etching operations did not generate any extremely hazardous waste during 2014. <br />Instead, 15,982 pounds of hazardous waste in the form of spent etch solution (CWC 135) <br />were generated. This represents a reduction in extremely hazardous waste. <br />2.2 Other etchin waste <br />Engineering's Micro Nano Technology Center (MNTC) generates extremely hazardous <br />aqueous wastes (CWC 135) from micro fabrication processes. Etchant solutions are <br />applied to remove metals and silicon oxides/silicon nitrides as a preparation step prior to <br />applying additional materials to the top of silicon wafers. After surface preparation, <br />substrates are rinsed with water. This is a nonhazardous categorical process, the <br />wastewater is collected in a retention tank and is sampled and analyzed before it is <br />approved for release to sanitary sewer. This process generated approximately 23 lbs of <br />CWC 135 in 2014. <br />MNTC continues to optimize their processes through a number of activities such as <br />chemical reuse and experimentation with iess toxic alternatives. MNTC have been <br />replacing wet chemical etching and cleaning with plasma etching because it is more <br />controllable and safer, and also produces less hazardous waste. <br />SeptemUer 1, 2015 SB 14 Report <br />