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Receiving <br />Inner Layer <br />Dry Film <br />1 <br />Copper Etch <br />& Photoresist <br />Strip <br />2 <br />Black Oxide <br />3 <br />Lay-up <br />Hot & Cold <br />Press <br />4 <br />Lika,0lifornia Schematic Flow Diagei <br />Drilling <br />Desmear and/ <br />or Copper <br />Deposition <br />5 <br />Outer Layer <br />Dry Film <br />6 <br />I Copper & Tin <br />Plating <br />7 <br />Photoresist <br />Strip, Copper <br />Etch, & Tin <br />Strip 8 <br />Nickel & Gold <br />Tip Plating <br />9 <br />Soldermask & <br />Legend <br />10 <br />Hot Air Level i <br />1 11 <br />Fabrication & <br />Final <br />Gleaning <br />12 <br />Final <br />Inspection <br />Shipping <br />Waste Water <br />Treatment <br />13 <br />