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COMPLIANCE INFO_PRE 2019
Environmental Health - Public
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2200 - Hazardous Waste Program
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PR0220083
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COMPLIANCE INFO_PRE 2019
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Last modified
11/19/2024 1:50:47 PM
Creation date
11/1/2018 12:40:45 PM
Metadata
Fields
Template:
EHD - Public
ProgramCode
2200 - Hazardous Waste Program
File Section
COMPLIANCE INFO
FileName_PostFix
PRE 2019
RECORD_ID
PR0220083
PE
2254
FACILITY_ID
FA0001542
FACILITY_NAME
VIKTRON EXPRESS
STREET_NUMBER
1443
STREET_NAME
NAVY
STREET_TYPE
DR
City
STOCKTON
Zip
95206
APN
16330017
CURRENT_STATUS
02
SITE_LOCATION
1443 NAVY DR
P_LOCATION
01
P_DISTRICT
001
QC Status
Approved
Scanner
SJGOV\rtan
Supplemental fields
FilePath
\MIGRATIONS\N\NAVY\1443\PR0220083\COMPLIANCE INFO 1990 - 2006.PDF
QuestysFileName
COMPLIANCE INFO 1990 - 2006
QuestysRecordDate
7/12/2018 4:49:25 PM
QuestysRecordID
3928087
QuestysRecordType
12
QuestysStateID
1
Tags
EHD - Public
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f . <br />Process Name <br />Process <br />Average Daily <br />Discharge <br />Process Description <br />Multilayer Pumice Scrub <br />3,060 <br />Preclean cores prior to Multilayer Dry Film. <br />{Multilayer Dry Film Developer <br />6,120 <br />Remove photopolymer that has not been exposed to UV light, <br />Multilayer Etch/Strip <br />10,200 <br />Etch copper not cover by photopolymer and remove photopolymer. <br />Black Oxide <br />25,500 <br />Coat copper pattem with oxidized copper prior to lamination. <br />Plate Scrub <br />1,020 <br />Clean stainless steel, lamination separator plates. <br />Deburer <br />3,060 <br />Clean panels following drilling. <br />Cuposit <br />30,600 <br />Remove glass smear and non-electrolyticly plate copper on panel.. <br />Outerlayer Dry Film Developer <br />6,120 <br />Remove photopolymer that has not been exposed to UV light. <br />Pattern Plate <br />35,700 <br />Plate copper and tin on exposed copper pattern. <br />Prototype Plate <br />15,300 <br />Plate copper and tin on exposed copper 2attern. <br />Strip/Etch/Strip <br />15,300 <br />Remove photopolymer, etch copper not cover by tin and remove tin. <br />SM Pumice Scrub <br />3,060 <br />Preclean panels prior to soldermask application. <br />SM Developer <br />6,120 <br />Remove soldermask that has not been exposed to UV light. <br />Hot Air Level <br />8,160 <br />Coat copper, not covered with soldermask, with solder. <br />`lips Solder Strip, Cleaner/Scrub <br />4,080 <br />Remove solder from fingers and clean prior to gold plating. <br />Micro Plate <br />5,100 <br />Plate nickel and gold on the circuit board fingers. <br />Fabrication Scrubber <br />4,080 <br />Scrub circuit boards following routing. <br />Lab <br />510 <br />Anal is of process baths. <br />Photo Processor <br />1,020 <br />Exposure and developing of photo tools. <br />Screen Making, <br />2,040 <br />Prepare silk screens for legend application. <br />Sanitary Sources <br />Rest rooms / Break rooms 1 5,000 17 rest rooms in the plant and shop, 2 break room in the plant and shop. I, <br />
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