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only the locations of the silk screen, dry film, solder,and nickel and gold processes are documented at this time as shown on site plans acquired by AGE.Most, if not all, of the processes described above are assumed to have taken place in the plating bath areas in the southern portion of the building. Undoubtedly, many of the materials listed above were used only in small quantities. The chemicals of potential concern include the metals copper, nickel, lead, tin, and possibly cobalt.High and low pH may be a local concern. During the course of several site inspections,Mr. Doug Wilson of the PHS-EHD did not see storage or use of organic solvents on the premises; therefore the PHS-EHD and DTSC do not consider organic solvents to be chemicals of concern. 2.2.1.Plating Bath Area The plating bath area in the southern portion of the building consists of an eastern bermed area and a western area. Two sumps were located in the area, one still open in the SW comer, one backfilled with concrete in the NW comer.The western area included a nickel and gold plating area and a solder flux room,as can be seen on Figure 2. Processes conducted in both areas are believed to have included metal etching and nickel,chromium and copper plating.The concrete flooring was etched in the eastern plating area, and more locally in the western plating area. A patch of the etched concrete flooring in the western area covered a portion of an expansion joint between concrete slabs,thereby providing a potential pathway to the subsurface. The bemred plating area was utilized for wastewater storage after the sewer connection was cut off by the City of Stockton in June 1993. Wastewater was allowed to accumulate directly on the floor, according to Mr. Doug Wilson of the PHS-EHD. According to Mr. John Hinkel, standing water was not accumulated on the concrete floor. In either case, chemicals of potential concern include the metals cobalt, copper, nickel, lead and tin. Locally, high or low pH conditions may be a concern. 2.2.2. Solder Flux Room In the southeast comer of the building, in the comer of the metal plating area, is a room utilized for soldering.Details of the operation are not known to AGE, but Mr. Wilson of the PHS-EHD noted to AGE that lead contamination of the concrete walls and floor was a concern in the room 2.2.3.Treatment/Chemical Storage Area The treatment/chemical storage area contained low concrete-secondary containment structures and four sumps, three of which have been abandoned by filling with concrete at the time of preparation of this work plan.The area was utilized for the wastewater treatment system The specifics of the chemical storage in the area are not known to AGE,but probably included materials for the water treatment system, metals solutions and corrosives for the plating processes. Chemicals of potential concern include the metals cobalt,copper,nickel,lead and tin.Locally,high or low pH conditions may be a concern. 2.2.4. Material Preparation Room North of the eastern plating room is a material preparation room. A large area of concrete is oil-stained from a piece of machinery. A concrete-filled abandoned floor drain is in the area. Material preparation activities are not currently known to AGE, but may have included cutting and etching of materials. Potential contaminants of concern would include metals and corrosive pH disposed down the drain 2.2.5. Miscellaneous and Tank Storage Areas The asphalt-paved area east of the building was utilized for above-ground tank storage of treated wastewater. A release of untreated, or contaminated water from a polyvinyl tank in the driveway near the building resulted in excavation of soil. An oval area approximately 8 feet wide and 42 feet long was excavated, as shown on Figure 2. There is a shallow pit or open boring in the area that was a shallow sump for the release valve on the poly tank. Page 9