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2.0 SCOPE OF WORK
<br /> 2.1 SITE DESCRIPTION AND PROJECT AREAS
<br /> The former RV Circuits site is located on the southeast comer of the intersection of Worth Street and South Center Street in
<br /> an area of mixed light industrial, commercial and residential land use. The site is at an elevation between 10 feet and 15 feet
<br /> above mean sea level (MSL), closer to the 15 feet above MSL. The regional surface topography slopes gently toward the
<br /> west-southwest to southwest.
<br /> The irregularly-shaped, approximately 32,740-square-foot site is occupied by a 60-foot by 120-foot building, asphalt-paved
<br /> parking lot and driveway, and a covered concrete-floored area south of the building. Locally, small patches of soil are
<br /> exposed in disturbed portions of the asphalt. Much of the northern half of the building was utilized for office space and silk
<br /> screening and photography related uses; the southern half was utilized for plant maintenance, chemical and parts storage,
<br /> laboratory use and processes for the manufacture of circuit boards. The covered, concrete-paved area south of the building
<br /> was utilized for chemical storage and for a treatment facility to treat waste-water generated during the manufacturing process.
<br /> A sewer line runs under the east side of the building to Worth Street. An industrial sewer line runs from the south end of the
<br /> building along and outside the east side of the building to Worth Street. Storm drains are located near the southwest and
<br /> northwest comers of the property.A cement-filled former floor drain is located in the material preparation room as shown on
<br /> Figure 2.
<br /> An inactive municipal well,pump station No. 37-01, owned by California Water Service is located on the adjacent property
<br /> south of the subject site, approximately 33 feet from the property line. The well is not in use at the current time due to
<br /> excessive methane production.The well is screened from 136 feet to 472 feet bsg.
<br /> 2.2 SITE HISTORY
<br /> As noted above, the subject site has been utilized as a circuit board manufacturing facility. Prior to the occupancy of RV
<br /> Circuits,the site was utilized an auto body shop and for residential purposes.Activities on the site by Rainbow Auto body are
<br /> not documented;AGE could find no record of hazardous material usage,storage or incidents on the site as noted above.
<br /> The northern portion of the existing building was utilized by RV Circuits for photography and film, office and business
<br /> space, the southern half was utilized for plant maintenance, processes related to the manufacturing of circuit boards, and
<br /> chemical and equipment storage. The covered, concrete-floored area south of the building was utilized for the wastewater
<br /> treatment facility and for chemical storage. The asphalt-paved area east of the southern half of the building was utilized for
<br /> above-ground tank storage of treated water and manufacturing chemicals.
<br /> Review of RV Circuits' Material Data Safety Sheets found in binders in the building identified the following processes
<br /> conducted and materials utilized for the processes during the manufacture of the circuit boards:
<br /> • General - high and low pH corrosives, slacked lime (calcium hydroxide), metal hydroxide sludge (containing
<br /> copper,nickel and lead),and Clarofloc GW 21X(acrylamide-acrylic acid copolymer emulsion in paraffin oil);
<br /> • O Posit Process-Macudizer 9204,9275,9276 and 9279(polar aprotic organic solvents),
<br /> etching agents,Electroless Copper 22A and 22B,Accelerator 41-C,Catalyst Premix and
<br /> TS-16;
<br /> • Silk Screen&Dry Film-Hydrogen peroxide,Foam Free(R)946 rev(organics,glycol ether),
<br /> cellosolve acetate,potassium carbonate(K2CO3),Laminar(R)AE dry film photopolymer
<br /> (acrylic monomers),24D Liquid developer, Screen Cleaner 420;
<br /> Black Oxide Process-Sulfuric acid,748 Salts(potassium peroxymonosulfate);
<br /> Solder Plating Process-Acid cleaner 717,sulfuric acid,copper sulfate,hydrochloric acid,
<br /> Fluoborate Grain Refiner(purified petone solution),hydrogen peroxide,fluoboric acid,tin
<br /> fluoborate solution,lead fluoborate solution,boric acid,nitric acid,and Talco Metals(99.9%
<br /> copper); - -
<br /> Etching&Solder-Etchant(alkaline),ammonium hydroxide,Solder Flow 10 and 5
<br /> (oxyalkalated glycerin,oxyalkalate in a glycol ether),copper chloride,and hydrochloric acid;
<br /> • Tap Plating Process-Nickel sulfariate,nickel chloride,sulfuric acid,M&T Nickel Additive
<br /> SA-1 (aliphaticsulfanate;formaldehyde),M&T RR5(organic),M&T AP20(anionic
<br /> surfactant,formaldehyde),M&T Anti-pit No. 12(anionic surfactant,formaldehyde),M&T
<br /> Nickel Additive PCB(formaldehyde,benzoic sulfimide),Solder Stripper 709(ammonium
<br /> bifluoride,hydrogen peroxide),M&T SNP Solder Stripper(acids),M&T CK Copper
<br /> Conditioner(surfactants, ferric chloride),and Orosene 80 Gold Salts(potassium cyanorate,
<br /> cobalt complex).
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