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3MTM Bonding Film 583 Application Equipment Suggestions Note:Appropriate application equipment can enhance bonding film performance.We suggest the following equipment for the user's evaluation in light of the user's particular purpose and method of application. The type of application equipment used to bond 3MT" Bonding Film 583 will depend on the application involved and on the type of equipment available to the user.Thin films and flexible substrates can be bonded using a heated roll laminator where heat and pressure can be varied to suit the application.Larger,thicker substrates can be bonded using a heated static press or,in some cases,an autoclave.For applications where a shaped adhesive is to be transferred to a flat or three- dimensional part,a hot shoe or thermode method may be appropriate. It is recommended that whatever method of bonding is chosen by the user,the optimum bonding conditions should be predetermined with substrates specific to user's application. Directions For Use—Heat Activation To make a bond,remove the liner and place the adhesive film between the two substrates.The bond is then made through heat and pressure using a heated press,a hot roll laminator,a hot shoe thermode method or similar equipment. Alternatively,the adhesive can be first tacked(lightly bonded)to one of the substrates using low heat,the liner can then be removed and second substrate placed to the exposed adhesive surface,and a bond made using heat and pressure.Since 3MT" Bonding Film 583 has a slight surface tack,in some cases it may be tacked to a substrate with pressure only(no Suggested TACKING Conditions 100°F to 120°F(38°C to 49°C)bondline temperature 2-5 seconds dwell time 5-20 psi pressure For optimum bonding,the heat,pressure and dwell time for using 3MT" Bonding Film 583 will depend upon the type and thickness of the substrates being bonded together. A suggested starting point,however,is to use the bonding conditions described below. Suggested BEGINNING Bonding Conditions 225°F to 300°F(107°C to 149°C)bondline temperature 2-5 seconds dwell time 15-20 psi pressure (2)