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3MTM Bonding Film 583 Directions For Use— Heat Activation (continued) One approach to establishing the correct/optimum bonding conditions for a user's application is to evaluate a series of bonding temperatures,for example 200,225,250,275 and 300°F(93, 107, 121, 135 and 1=19°C).Time and pressure will be dictated by the thickness of the substrate and the type of substrate being bonded.Thicker substrates and surfaces that may be more difficult to bond will require longer times,higher pressures and higher temperatures. If voids are experienced in the bondline,they can be minimized by increasing pressure. Once the bond is made,the bondline should be allowed to cool somewhat before stress is applied to the bond.Generally, cooling the bondline below 150°F(66°C)is adequate to allow the bonded parts to be unfixtured/unclamped and handled. For reference,the following table shows typical bond strengths for bonds made at various temperatures.Such data can be used to evaluate optimum bondline temperatures.It is important to note that this table is valid only for the specific substrates shown.Varying temperature,pressure,or substrates can affect bond strengths. User should develop a similar table with substrates specific to user's application. Note:Temperatures shown are bondline temperatures and not heat block or roll settings! 900 Peel Strengths of Bonds (2 and i sec.Dwell at :oBonding Bondline FR-4/Aluminum CRS/Aluminum Temperature 2 sec. 20 sec. 2 sec. 20 sec. 75°F(24°C) 9 piw 9 piw 5 piw 6 piw 95°F(35°C) 9 piw 9 piw 6 piw 6 piw 115°F(46°C) 9 piw 9 piw 6 piw 6 piw 135°F(57°C) 10 piw 10 piw 6 piw 7 piw 155°F(68°C) 11 piw 11 piw 7 piw 9 piw 175°F(79°C) 12 piw 13 piw 8 piw 10 piw 195°F(90°C) 13 piw 14 piw 9 piw 12 piw 215°F(101°C) 14 piw 14 piw 11 piw 14 piw 235°F(113°C) 14 piw 13 piw 12 piw 13 piw 255°F(124°C) 12 piw 12 piw 13 piw 13 piw 275°F(135°C) 12 piw 12 piw 12 piw 12 piw 295°F(146°C) 12 piw 11 piw 12 piw 12 piw 315°F(157°C) 11 piw 11 piw 11 piw 12 piw 335°F(168°C) 11 piw 11 piw 10 piw 11 piw 355°F(179°C) 11 piw 10 piw 6 piw 9 piw Peel values given in piw(pounds per inch width).ASTM D1876. Peel bonds were 1/2"wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate(alcohol wiped)or cold rolled steel (MEK wiped)'Bonds made on Sencorp device using 20 lbs.pressure. *Note: When using solvents,extinguish all ignition sources and follow the manufacturer's precautions and directions for use. (3)