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3MTM Bonding Film 583 Typical Performance Characteristics Note: I'hc fol Ioveing technical infornruion and clata should be considered representatk e or typical only and should not he used for specification purposes. Adhesion r Various SubstratesBonding Test Substrate Overlap l' Peel Aluminum(solvent wiped) 580 psi 10 piw Aluminum(etched) 630 psi 10 piw Aluminum(sanded,solvent wiped) 640 psi 10 piw Aluminum(scour pad abraded,solvent wiped) 660 psi 10 piw FR-4(printed circuit board substrate) 600 psi 11 piw Phenolic Board 500 psi 9 piw Cold Rolled Steel 750 psi 11 piw Stainless Steel NT 10 piw ABS(acrylonitrile-butadiene-styrene) NT 10 piw Ultem 1000(polyetherimide) NT 10 piw Soda Lime Glass NT 9 piw PVC(polyvinyl chloride) NT 10 piw Acrylic NT 10 piw Polypropylene NT <1 piw HDPE(high density polyethylene) NT <1 piw HIPS(high intensity polystyrene) NT 9 piw EPDM(ethylene-propylene-diene monomer rubber) NT <1 piw Neoprene(Shore A60) NT 6 piw Nitrile(Shore A60) NT 7 piw SBR(styrene butadiene resin) NT 16 pial Kapton 200E(polyimide film) NT 5 piw PET(polyester film) NT 3 piw PEN(polyethylene naphthalate film) NT 2 piw Denim Fabric NT 8 piw "NT"represents"Not Tested". OLS values given in psi(pounds per square inch).ASTM D1002.Peel values given in piw(pounds per inch width).ASTM D1876. OLS bonds were 1"x 1"using 20 mil etched aluminum bonded to each test substrate.Sintech 5/GL shear rate was 0.2"/minute. Peel bonds were 1/2"wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. Solvent wiped(MEK or alcohol)*;3MTM Scotch-BriteTM Scour Pad(green)abraded;sanded(500 grit sandpaper). Samples were bonded on Sencorp device for 5 seconds dwell(+10 seconds ramp time)at 315°F(157°C),20 pounds pressure. *Note: When using solvents,extinguish all ignition sources and follow the manufacturer's precautions and directions for use. (i)