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3MTM Bonding Film 583 <br /> Directions For Use—Solvent Activation <br /> There are advantages and disadvantages with heat and solvent activation.Under normal conditions,heat activation is the <br /> suggested method of bonding and will provide the greatest immediate adhesion strength.However,solvents such as MEK, <br /> toluene and/or acetone can also be used to activate bonding if user is working with substrates that are heat-sensitive or have <br /> irregular surface or shape <br /> The solvent may be applied to the film by brushing,wiping,spraying or dipping.It is important that the solvent be allowed <br /> sufficient activating time to solvate the adhesive and bring it to a tacky,pressure sensitive state(typically 10-30 seconds). <br /> Adhesive legs should appear during touch-testing before substrate is bonded.Bonding should occur before tackiness <br /> disappears.If film is too wet,substrate may slip from bonding position;if too dry,a good bond may not develop. <br /> When a solvent activation method is used,maximum adhesion strength will not be achieved immediately because it will be <br /> related to the drying time of solvent from the adhesive.If the bond undergoes natural drying in ambient temperatures,bond <br /> build-up may continue for 30 days until maximum adhesion is achieved.If the bond is exposed to constant low heat <br /> H50°F/66°C)after initial solvent activation,maximum adhesion can often be reached within 2430 hours. <br /> *Note: When using solvents,extinguish all ignition sources and follow the manufacturer's precautions and directions for use. <br /> Directions For Use — Crosslinking <br /> 3MT1 Bonding Film 583 may also be slightly crosslinked to enhance adhesion performance.Crosslinking of this film can <br /> typically be achieved by heating the bondline at 350°F(177°C)for five minutes. <br /> Note:All reported data has not undergone crosslinking unless otherwise stated. <br /> (4) <br />