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Environmental Standard Procedure Page 2 ® Easisoly (< 1% voi) Rinse --Wash Basin in Screen Prep ® Anodal Cleaner Solution (< 2% vol) - Etch Room West Wall Floor Drain 3.2. Disposal Procedures 3.2.1. Zip Developer - the spent plate developing solution is discharged into the U1 T2 process waste water collection tank via the Metalphoto processor"Waste Developer„ collection container. When the processor is serviced and cleaned, the waste developer container is emptied into the sink drain located along the west wall of the darkroom. The amount of discharge is 3 gal per processor service and the frequency is related to the quantity of Metalphoto sheets processed, therefore, the person responsible for servicing the processor must record the discharge information on the Darkroom Hazardous Waste Log. 3.2.2. Zip Fixer -the spent plate fixing solution is discharged into the U1 T2 process waste water collection tank via the Metalphoto processor"Waste Fixer" collection container after silver recovery has been completed. The collected waste fixer is poured into the Silver Recovery system tank. The Silver Recovery system is activated and monitored by the person servicing the Metalphoto processor. Test strips are used to indicate silver concentration. That person makes entries into the Silver Recovery Log and will initiate additional cycles if any silver is still present or discharge the waste fix solution into the sink located on the west wall of the Darkroom if all silver has been removed. The amount of discharge is 3 gal per processor service and the frequency is related to the quantity of Metalphoto sheets processed, therefore, the person responsible for servicing the processor must record the discharge information on the Darkroom Hazardous Waste Log. 3.2.3. Acid Purification Unit(APU) -- spent anodizing solution is automatically discharged into the U1 T3 pH adjust tank via the APU located in the outside tank pad area. The APU is utilized only as needed to maintain a dissolved Aluminum concentration of- 12 ppm within the anodizing tank. If the anodizing operator determines that the APU needs to be turned on in order to maintain that concentration, they will record how many cycles the APU processed that day. Each cycle discharges - 4 gallons of waste anodizing solution. Multiply the number of cycles that day by 4 to estimate the total amount discharged and record that estimate on the Anodizing Hazardous Waste Log. 3.2.4. Frost Solution - spent frost solution (ammonium bifluoride) is manually discharged into the U1 T1 process waste water collection tank via a floor drain located near the south east corner of the Etch room. When it has been determined that the Frost solution is exhausted a drain valve is partially opened draining the solution slowly into the On-Site treatment system for eventual pH adjustment. The tank is then washed and drained again with approximately 5 gallons of additional water. This results in a total discharge of - 75 gallons each time the tank is changed. The operator responsible for discharging the frost solution must take care to routinely monitor the T5 pH controller outside to verify that the final pH discharge is between 6 to11 and then record the discharge on the Etch Hazardous Waste Log. 3.2.5. Etch Rinse - spent etch rinse solution is manually discharged as required into the U1 T1 process wastewater collection tank via a floor drain located near the south east corner of the Etch room. When the solution is no longer effective, the drain valve is partially opened draining the solution slowly into the On-Site treatment system for eventual pH adjustment. The tank is then washed and drained again with